We, Molex Kiire, have achieved epoch-making technological innovation in the field of electronic component by the means of combining Etching, Alignment technology both of which we acquired through considerable experience and new Polyimide processing and Plating processing technology.

Using our composite material processing technology we have already started mass production
of integrated suspension blanks for HDD use, and we have achieved noticeable result in the field of circuit components such as FPC and packaging parts such as CSP,BGA and MCM. Furthermore, we can comply with our customer's various technology requests through precise alignment exposure device, polyimide etching machine, nickel and gold plating machine which were adopted for composite material processing.

We Molex Kiire will keep challenging towards many potentials and pursue exploitation of new field by developing new technology.