FGHP

In order to solve the heat problem which arises among downsized and speed-upped electronic device, we developed new cooling technology which enables downsized and low-cost products by combining our fundamental technology of photo etching and special metal bonding technology.
FGHP is the small high-end heat spreader which has the heat-pipe structure in a form of plane plate. And this enables to effectively and rapidly cool and diffuse high-power heat.

<Application>
   High-speed semiconductor package
   High-intensity LED
   CPU
   SiP
   PC
   Home-use game machine
   Workstation

Product's brief overview
Cooling component with heat pipe structure which has refrigerant
and wick (capillary member) formed within ultrathin metal sheet.
Photo：Example of product
40mm thickness 1.2mm

Characteristics
High speed and high heat diffusivity(sonic speed)
Reduced thickness:1~2mmt
Light weighted：Hollow construction interior
Heat resistance:260°C 2min

Individual Capability
Comparison example of same size and thickness:
Comparison result of Copper sheet(Metal) and FGHP in thermal diffusion and achieving temperature.

Composite characteristic
3D Comparison result of Copper sheet(Metal) and FGHP with cooling fin in terms of thermal diffusion and achieving temperature.

Example of products lay out
Example of fin directed to surface direction and circuit implementation.