CFSA & Integrated Suspension Blanks(Manufacturing Process)

Form the circuit on the base

Main Product Specification

1. Three-layer structure
Copper/Polyimide/Stainless Steal: 18/36/20µ

2. Copper Circuit
Thickness tolerance : ±10%

3. Polyimide insulating layer
Thickness tolerance : ±10%

4. Suspension
Datum hole tolerance: ±0.005mm

5. Circuit/Suspension
Alignment tolerance : ±0.005mm

6. Protection with Plating
Ni thickness : 1.5±0.1µ
Au thickness : 0.5±0.05µ

Embed circuit in the polyimide
and bond with SS

Separate from base metal and
etch SS and Polyimide

Integrated Suspension Blanks(Manufacturing Process)

Composite Material of
SS/Polyimide/Cu

Main Product Specification

1. Three-layer structure
Copper/Polyimide/Stainless Steal: 12/18/20µ

2. Circuit Width
Line and Space : 25/25µ (When Cu is 12µ)

3. Suspension
Datum hole tolerance: ±0.005mm

4. Circuit/Suspension
Alignment tolerance : ±0.005mm

5. Protection with Plating
thickness : 1.5±0.1µ
Au thickness : 0.5±0.05µ

SS and Cu layer etching

Polyimide etching and Circuit gold plating