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Integrating machine and circuit components is one of the answer to the demand for downsizing and density growth and at the same time it leads to the creation of new application.
CSFA technology which was developed by Molex Kiire brought innovation to the production of miniaturizing Hard disk magnetic head as well as it created a new possibility in the field of semiconductor package.
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CFSA < Circuit Flex Suspension Assembly
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Producing signal circuit by combining photolithographic process and plating, embedding it to the insulated layer, laminating it with the spring material such as SST and then produce outer shape configuration with etching process.
CFSA corresponds to the various multi-layer.
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Integrated
Suspension Blanks
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With this production method, we produce suspension blanks
by etching each layer of prelayered material of Copper,
Polyimide and Stainless Steel. |
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Each type became feasible technology by innovating
various processes such as high accuracy layering technique,
etching of polyimide layer, alignment and plating in addition
to the existing metal etching technology. |
